Power switch circuit, ic structure of power switch circuit, and method of forming ic structure

ABSTRACT

An integrated circuit device includes: an integrated circuit module; a first field-effect transistor coupled between the integrated circuit module and a first reference voltage, and controlled by a first controlled signal; and a second field-effect transistor coupled between the integrated circuit module and the first reference voltage; wherein the second field-effect transistor is a complementary field-effect transistor of the first field-effect transistor, and the first field-effect transistor and the second field-effect transistor are configured to generate a second reference voltage for the integrated circuit module according to the first control signal.

BACKGROUND

A power switch is coupled between a supply power and a functionalcircuit for selectively supplying power to the functional circuit. Forexample, when the functional circuit is under sleep mode, the powerswitch may be opened to cut off the power of the functional circuit forreducing the power consumption of the circuit system. The power switchmay be controlled by signals generated by a controller that may controlthe operating mode of the functional circuit. To increase the operatingspeed of the circuit system, a power switch should have strong wake upforce to power-up the functional circuit when the operation mode of thefunctional circuit is changed into the normal operation mode from thesleep mode, for example. However, the power switch with strong wake upforce may occupy a large area in the circuit system. Therefore, a novelarchitecture of power switch without the area penalty is highlydesirable in the field of advanced IC (Integrated circuit) device.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a diagram illustrating an electronic design automation systemin accordance with some embodiments.

FIG. 2 illustrates one example of a method of designing and fabricatinga semiconductor-based circuit.

FIG. 3 is a diagram illustrating an IC device in accordance with someembodiments.

FIG. 4 is a timing diagram illustrating an intermediate supply voltageof a power switch circuit in accordance with some embodiments.

FIG. 5 is a diagram illustrating an IC device in accordance with someembodiments.

FIG. 6 is a diagram illustrating an IC device in accordance with someembodiments.

FIG. 7 is a cross-sectional diagram illustrating a portion of a CFETlayout in accordance with some embodiments.

FIG. 8 is a cross-sectional diagram illustrating a layout of a powerswitch circuit in accordance with some embodiments.

FIG. 9A is a diagram illustrating a layout structure of a power switchcircuit in accordance with some embodiments.

FIG. 9B is a diagram illustrating a layout structure of a power switchcircuit in accordance with some embodiments.

FIG. 10A is a diagram illustrating a layout structure of a power switchcircuit in accordance with some embodiments.

FIG. 10B is a diagram illustrating a layout structure of a power switchcircuit in accordance with some embodiments.

FIG. 11A is a diagram illustrating a layout structure of a power switchcircuit in accordance with some embodiments.

FIG. 11B is a diagram illustrating a layout structure of a power switchcircuit in accordance with some embodiments.

FIG. 12A is a diagram illustrating a layout structure of a power switchcircuit in accordance with some embodiments.

FIG. 12B is a diagram illustrating a layout structure of a power switchcircuit in accordance with some embodiments.

FIG. 13A is a diagram illustrating a layout structure of a power switchcircuit in accordance with some embodiments.

FIG. 13B is a diagram illustrating a layout structure of a power switchcircuit in accordance with some embodiments.

FIG. 14 is a flowchart illustrating a method of forming an IC structurein accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

FIG. 1 is a diagram illustrating an electronic design automation system100 in accordance with some embodiments. As shown in FIG. 1, system 100includes an electronic design automation (“EDA”) tool 110 having a placeand route tool including a chip assembly router 120.

The EDA tool 110 is a special purpose computer formed by retrievingstored program instructions 136 from a computer readable storage medium130, 140 and executing the instructions on a general purpose processor114. Processor 114 may be any central processing unit (“CPU”),microprocessor, micro-controller, or computational device or circuit forexecuting instructions. The non-transitory machine readable storagemedium 130, 140 may be a flash memory, random access memory (“RAM”),read only memory (“ROM”), or other storage medium. Examples of RAMsinclude, but are not limited to, static RAM (“SRAM”) and dynamic RAM(“DRAM”). ROMs include, but are not limited to, programmable ROM(“PROM”), electrically programmable ROM (“EPROM”), and electricallyerasable programmable ROM (“EEPROM”), to name a few possibilities.

System 100 may include a display 116 and a user interface or inputdevice 112 such as, for example, a mouse, a touch screen, a microphone,a trackball, a keyboard, or other device through which a user may inputdesign and layout instructions to system 100. The one or more computerreadable storage mediums 130, 140 may store data input by a user such asa circuit design and cell information 132, which may include a celllibrary 132 a, design rules 134, one or more program files 136, and oneor more graphical data system (“GDS”) II files 142.

EDA tool 110 may also include a communication interface 118 allowingsoftware and data to be transferred between EDA tool 110 and externaldevices. Examples of a communications interface 118 include, but are notlimited to, a modem, an Ethernet card, a wireless network card, aPersonal Computer Memory Card International Association (“PCMCIA”) slotand card, or the like. Software and data transferred via communicationsinterface 118 may be in the form of signals, which may be electronic,electromagnetic, optical, or the like that are capable of being receivedby communications interface 118. These signals may be provided tocommunications interface 118 via a communications path (e.g., achannel), which may be implemented using wire, cable, fiber optics, atelephone line, a cellular link, a radio frequency (“RF”) link and othercommunication channels. The communications interface 118 may be a wiredlink and/or a wireless link coupled to a local area network (LAN) or awide area network (WAN).

Router 120 is capable of receiving an identification of a plurality ofcells to be included in a circuit layout, including a list 132 of pairsof cells, selected from the cell library 132 a, within the plurality ofcells to be connected to each other. Design rules 134 may be used for avariety of processing technologies. In some embodiments, the designrules 134 configure the router 120 to locate connecting lines and viason a manufacturing grid. Other embodiments may allow the router toinclude off-grid connecting lines and/or vias in the layout.

FIG. 2 illustrates one example of a method 200 of designing andfabricating a semiconductor-based circuit. In operation 202, agate-level netlist is developed or extracted. As will be understood byone of ordinary skill in the art, the gate-level netlist can beextracted from circuit schematic by processor 114 of system 100.

In operation 204, floor planning for the semiconductor circuit isperformed by system 100. In some embodiments, floor planning includesdividing a circuit into functional blocks, which are portions of thecircuit, and identifying the layout for these functional blocks.

In operation 206, power planning for the semiconductor circuit isperformed by system 100. Power planning includes identifying the powerlayout for the functional blocks of the semiconductor circuit. Forexample, the conductive traces for routing power and ground on thevarious conductive layers of the semiconductor circuit.

In operation 208, system 100 performs placement for the semiconductorcircuit. According to some embodiments, the circuit placement includesdetermining the placement for the electronic components, circuitry, andlogic elements. For example, the placement of the transistors,resistors, inductors, logic gates, and other elements of thesemiconductor circuit are selected in operation 208.

In operation 210, system 100 performs power-grid enhancement.

In operation 212, the routings for the devices and semiconductor circuitare mapped. Routing in operation 212 is performed by router 120 ofsystem 100.

In operation 214, a data file, such as a graphic database system (“GDS”)II file, including data representing the physical layout of the circuitis generated and stored in a non-transient machine readable storage 140.As will be understood by one of ordinary skill in the art, the data fileis used by mask making equipment, such as an optical pattern generator,to generate one or more masks for the circuit.

In operation 216, one or more masks for the semiconductor circuit arecreated based on the data file stored in operation 214. Once thephysical design layout is generated, the physical design may be sent toa manufacturing tool to generate photolithographic masks that may beused for fabricating the semiconductor circuit. The physical designlayout may be sent to the manufacturing tool through that the LAN/WAN orother suitable forms of transmission from the EDA to the manufacturingtool.

According to some embodiments, in the operation 202, an integratedcircuit (IC) module with a novel power switch circuit is designed. Thepower switch circuit may be a header switch and/or a footer switch ofthe IC module. The IC module may be a random access memory (RAM). Forexample, the RAM may be a dynamic random access memory (DRAM) and astatic random access memory (SRAM). The power switch circuit isconnected to a first reference voltage (e.g. a core supply voltage) andto provide a second reference voltage (e.g. an intermediate supplyvoltage) to the IC module according to an operation mode of the ICmodule. The intermediate supply voltage may be lower than or the samewith the core supply voltage. For example, when the IC module is a RAMmodule, the power switch circuit is arranged to provide the intermediatesupply voltage to the IC module during the read mode of the IC module,and the power switch circuit is arranged to stop provide theintermediate supply voltage to the IC module during the write mode ofthe IC module. It is noted that, when the power switch is a footerswitch of the IC module, the power switch circuit is connected to afirst reference voltage (e.g. a core ground voltage) and to provide asecond reference voltage (e.g. an intermediate ground voltage) to the ICmodule according to an operation mode of the IC module. The intermediateground voltage may be higher than or the same with the core groundvoltage.

According to some embodiments, the transistors in the IC module and thepower switch circuit are implemented by complementary field-effecttransistor (CFET). A CFET device may be a modification of agate-all-around transistor or device. A CFET stacks both n-type andp-type devices on each other. In CFET device, the nFET and pFET wiresare stacked on each other. A CFET may be an nFET stacked on top of apFET wire, or two or more nFETs stacked on top of two or more pFETwires. Therefore, in the operation 208, the layouts of the power switchcircuit and the IC module may be formed on a layout architecture havinga plurality of interleaving n-type nanowires and p-type nanowires. It isnoted that a nanowire may be regarded as a semiconductor fin.

FIG. 3 is a diagram illustrating an IC device 300 in accordance withsome embodiments. The IC device 300 comprises a power switch circuit 302and an IC module 304. The power switch circuit 302 may be a headerswitch or a footer switch of the IC module 304. The power switch circuit302 may also comprise a header switch and a footer switch of the ICmodule 304. When the power switch circuit 302 is the header switch theIC module 304, the power switch circuit 302 is connected to a coresupply voltage VDD and to provide an intermediate supply voltage VDD_into the IC module 304 according to an operation mode of the IC module304. When the power switch circuit 302 is the footer switch (not shown)the IC module 304, the power switch circuit 302 is connected to a coreground voltage VGND and to provide an intermediate ground voltageVGND_in to the IC module 304 according to the operation mode of the ICmodule 304. For brevity, the present embodiments mainly focus on theheader switch of the IC module 304. A person skilled in this art mayunderstand the corresponding footer switch of the IC module 304 afterreading the description related to the header switch of the IC module304.

According to some embodiments, the IC device 300 further comprises aninverter 306 coupled to the power switch circuit 302. The power switchcircuit 302 comprises a p-type field-effect transistor (pFET) M1 and ann-type field-effect transistor (nFET) M2. Each of the pFET M1 and thenFET M2 may comprise two connecting terminals (e.g. a drain and asource) and one control terminal (e.g. a gate). The pFET M1 and the nFETM2 are configured to be a complementary field-effect transistor (CFET)structure. The pFET M1 may be a complementary FEE of the nFET M2. Thesource of the pFET M1 and the drain of the nFET M2 are coupled to thecore supply voltage VDD. The gate of the pFET M1 is coupled to an enablesignal Se and the input terminal of the inverter 306. The gate of thenFET M2 is coupled to the output terminal of the inverter 306. The drainof the pFET M1 and the source of the nFET M2 are arranged to output theintermediate supply voltage VDD_in to the IC module 304.

According to some embodiments, the inverter 306 is arranged to invertthe voltage level of the enable signal Se. As the pFET M1 and the nFETM2 are controlled by the enable signals Se with complementary voltagelevels respectively, the pFET M1 and the nFET M2 may be turned on andoff substantially at the same time.

FIG. 4 is a timing diagram illustrating the intermediate supply voltageVDD_in provided by the power switch circuit 302 when the power switchcircuit 302 is enabled by the enable signal Se in accordance with someembodiments. The curve 402 represents the variation of the intermediatesupply voltage VDD_in, and the curve 404 represents the variation of anexisting intermediate supply voltage provided by an existing powerswitch circuit (not shown). At time t1, the power switch circuit 302 isturned on by the enable signal Se, e.g. the voltage level of the enablesignal Se transits to the low voltage level (e.g. VGND) from the highvoltage level (e.g. VDD) at time t1. The voltage level of theintermediate supply voltage VDD_in (i.e. the curve 402) starts risingafter time t1. At time t2, the voltage level of the intermediate supplyvoltage VDD_in starts curve 402 reaches the high voltage level Vh, whichis close to the voltage level VDD, at time t2. On the other hand, forthe existing power switch circuit, the curve 404 also starts risingafter time t1, and reaches the high voltage level Vh at time t3. Incomparison to the existing art, the wake-up time or rising time of theintermediate supply voltage VDD_in is improved. Therefore, the powerswitch circuit 302 provides the intermediate supply voltage VDD_in witha relatively strong wake-up force without occupy extra area of thesemiconductor wafer, which will be described in the later paragraphs.When the power switch circuit 302 has a relatively strong wake-up force,the different wake-up times of the pFET M1 and the nFET M2 in the powerswitch circuit 302 caused by the process variation, e.g. the SF corneror FS corner, may be mitigated. The process corners occurred in thefabrication such that the operating speed of a power switch circuit 302may be tuned or adjusted after the fabrication. The process corner maybe a variation of fabrication parameters used in applying an integratedcircuit design to a semiconductor wafer. For example, the process cornermay be fast-fast (FF), slow-slow (SS), slow-fast (SF), or fast-slow (FS)corner, in which the first letter (e.g. “F” in FS corner) refers to theN-channel MOSFET (NMOS) corner, and the second letter (e.g. “S” in FScorner) refers to the P channel (PMOS) corner.

The embodiment of the power switch circuit 302 in FIG. 1 is to apply theenable signals (e.g. Se) with different voltage levels to the gates ofthe pFET M1 and the nFET M2. However, this is not a limitation of thepresent embodiments. The enable signal Se may be arranged to control oneof the pFET M1 and the nFET M2 as shown in FIG. 5. FIG. 5 is a diagramillustrating an IC device 500 in accordance with some embodiments. TheIC device 500 comprises a power switch circuit 502 and an IC module 504.The power switch circuit 502 is the header switch the IC module 504, andthe power switch circuit 502 is connected to the core supply voltage VDDto provide the intermediate supply voltage VDD_in to the IC module 504according to an operation mode of the IC module 504.

According to some embodiments, the power switch circuit 502 comprises apFET M1′ and an nFET M2′. The pFET M1′ and the nFET M2′ are configuredto be a CFET. The source of the pFET M1′ and the drain of the nFET M2′are coupled to the core supply voltage VDD. The gate of the pFET M1′ iscoupled to an enable signal Se′. The gate of the nFET M2′ is coupled tothe drain of the nFET M2′. The drain of the pFET M1′ and the source ofthe nFET M2′ are arranged to output the intermediate supply voltageVDD_in to the IC module 504.

According to some embodiments, the enable signal Se′ is arranged tocontrol the on/off of the pFET M1′. When the enable signal Se′ turns onthe pFET M1′ by the low voltage level (e.g. VGND), the pFET M1′ isarranged to provide the intermediate supply voltage VDD_in with thevoltage level of VDD to the IC module 504. When the enable signal Se′turns off the pFET M1′ by the high voltage level (e.g. VDD), the nFETM2′ is arranged to provide the intermediate supply voltage VDD_in withthe voltage level of VDD-VT to the IC module 504, in which the parameterVT is the threshold voltage of the nFET M2′. In other words, the powerswitch circuit 502 is arranged to selectively provide the intermediatesupply voltage VDD_in with the voltage level of VDD or the intermediatesupply voltage VDD_in with the voltage level of VDD-VT to the IC module504 according to the operation mode (or the voltage level of the enablesignal Se′) of the IC module 504. For example, when the IC module 504 isa data storage module (e.g. a RAM module), the power switch circuit 502is arranged to provide the intermediate supply voltage VDD_in with thevoltage level of VDD to the IC module 504 during the read mode in thenormal operation of the IC module 504, and the power switch circuit 502is arranged to provide the intermediate supply voltage VDD_in with thevoltage level of VDD-VT, which is lower than the voltage level VDD, tothe IC module 504 during the sleep mode of the IC module 504. During thesleep mode, the data in the IC module 504 may be kept intact by a lowersupply voltage, i.e. VDD-VT. Accordingly, the total power consumption ofthe IC device 500 may be reduced.

FIG. 6 is a diagram illustrating an IC device 600 in accordance withsome embodiments. The IC device 600 comprises a power switch circuit 602and an IC module 604. The power switch circuit 602 is the header switchthe IC module 604, and the power switch circuit 602 is connected to thecore supply voltage VDD to provide the intermediate supply voltageVDD_in to the IC module 504 according to an operation mode of the ICmodule 604.

According to some embodiments, the power switch circuit 602 comprises apFET M1″ and an nFET M2″. The pFET M1″ and the nFET M2″ are configuredto be a CFET. The source of the pFET M1″ is coupled to the core supplyvoltage VDD. The gate of the pFET M1″ is coupled to an enable signalSe″. The drain of the nFET M2″ is coupled to the drain of the pFET M1″.The gate of the nFET M2″ is coupled to the drain of the nFET M2″. Thesource of the nFET M2″ is arranged to output the intermediate supplyvoltage VDD_in to the IC module 604.

According to some embodiments, the nFET M2″ is configured to be adiode-connect transistor. The enable signal Se″ is arranged to controlthe on/off of the pFET M1″. When the enable signal Se″ turns on the pFETM1″ by the low voltage level (e.g. VGND), the pFET M1″ is arranged toprovide the intermediate supply voltage VDD_in with the voltage level ofVDD-VT to the IC module 604, in which the parameter VT is the thresholdvoltage of the nFET M2″. When the enable signal Se″ turns off the pFETM1″ by the high voltage level (e.g. VDD), the connection between thecore supply voltage VDD and the IC module 604 is opened to power-off theIC module 604. In other words, the power switch circuit 602 is arrangedto selectively provide the intermediate supply voltage VDD_in with thevoltage level of VDD-VT to the IC module 604 according to the operationmode (or the voltage level of the enable signal Se″) of the IC module604. The nFET M2″ may be regarded as a retention diode between the pFETM1″ and the IC module 604, and the pFET M1″ may be a controlling switchfor the retention diode. As the power switch circuit 602 is arranged toprovide the intermediate supply voltage VDD_in with the voltage level ofVDD-VT, which is lower than the voltage level VDD, to the IC module 604,the total power consumption of the IC device 600 may be reduced.

FIG. 7 is a cross-sectional diagram illustrating a portion of a CFETlayout 700 in accordance with some embodiments. For brevity, the CFETlayout 700 merely shows a p-type diffusion nanowire 702, an n-typediffusion nanowire 704, and a plurality of conductive layers706_1-706_n. According to some embodiments, the material of theplurality of conductive layers 706_1-706_n may be polysilicon or metalor a combination of polysilicon and metal. The polysilicon ispolycrystalline silicon, which is a high purity, polycrystalline form ofsilicon. The metal may be aluminum (Al). The semiconductor substrate,contacts, the metal layers, the via structures, and the power rails areomitted in FIG. 7. According to some embodiments, the p-type diffusionnanowire 702 is vertically stacked on the n-type diffusion nanowire 704.Therefore, a pFET may be formed over an nFET. The plurality ofconductive layers 706_1-706_n are arranged to surround the p-typediffusion nanowire 702 and the n-type diffusion nanowire 704 to form thegates of the pFET(s) and the nFET(s) respectively. It is noted thatplurality of conductive layers 706_1-706_n are not directly contactedwith the p-type diffusion nanowire 702 and the n-type diffusion nanowire704. For each conductive layer, at least a gate dielectric or adielectric layer (not shown) is disposed between the conductive layer(e.g. 706_1) and the diffusion nanowire (e.g. 702 and 704). The gatedielectric may be a high permittivity (high-k) dielectric layer.According to some embodiments, the high-k material may be oxide oftantalum (e.g. Ta₂O₅), oxide of zirconium (ZrO₂), oxide of aluminum, oroxide of silicon (e.g. SiO₂), or Al₃N₄, for example. The gate dielectricmay be formed or deposited by a process of chemical vapor deposition(CVD).

According to some embodiments, the n-type diffusion nanowire 704 may bevertically stacked on the p-type diffusion nanowire 702. Moreover, aplurality of consecutive n-type diffusion nanowires 704 may bevertically stacked on a plurality of consecutive p-type diffusionnanowires 702, or a plurality of consecutive p-type diffusion nanowires702 may be vertically stacked on a plurality of consecutive n-typediffusion nanowires 704.

According to some embodiments, the CFET layout 700 may be applied toform the layout 800 of the above mentioned power switch circuits (e.g.302, 502, or 602). FIG. 8 is a cross-sectional diagram illustrating alayout 800 of a power switch circuit in accordance with someembodiments. For brevity, the power switch circuit is the abovementioned power switch circuit 302. According to some embodiments, acut-poly layer 802 is disposed on a portion of the plurality ofconductive layers 706_1-706_n, and the cut-poly layer 802 is located ona position between the p-type diffusion nanowire 702 and the n-typediffusion nanowire 704. The cut-poly layer 802 is arranged to cut orseparate the portion of conductive layers into the gate electrode (e.g.804_1-804_a) of the pFET M1 and the gate electrode (e.g. 806_1-806_b) ofthe nFET M2 after the fabrication of the power switch circuit 302. It isnoted that there is no physical structure of cut-poly layer 802 in thefabricated IC structure. The cut-poly layer 802 shown in the layout 800represents that a specific mask structure is used to cut the coveringconductive layers during the fabrication step. In the fabricated ICstructure, the area covered by a cut-poly layer may be a space filled inby dielectric material as the portion of the conductive layer isremoved.

In addition, the layout 800 further comprises four cut-diffusion layers808_1-808_4. The cut-diffusion layers 8081 and 808_2 are disposed on theedges of the p-type diffusion nanowire 702 and the n-type diffusionnanowire 704 respectively, and the cut-diffusion layers 8081 and 808_2are overlapped with the conductive layers 706_1 and 706_n respectively.The cut-diffusion layers 808_3 and 808_4 are overlapped with theconductive layers 806_1 and 806_b respectively. During the fabrication,a cut-diffusion layer may represent an edge of a diffusion layer.Therefore, the cut-diffusion layers 808_3 and 808_4 are arranged to cutthe n-type diffusion nanowire 704 into three portions, i.e. 810_1-810_3.It is noted that there is no physical structure of cut-diffusion layers808_1-808_4 in the fabricated IC structure. The cut-diffusion layers808_1-808_4 shown in the layout 800 represents that a specific maskstructure is used to cut the covering diffusion nanowires (i.e. 702 and704) during the fabrication step. In the fabricated IC structure, thearea covered by a cut-diffusion layer may be a space filled in bydielectric material as the portion of the diffusion nanowire is removed.According to some embodiments, a structure connected poly on gate oxideand diffusion edge may be formed in the area of a cut-diffusion layerafter fabrication.

Accordingly, the pFET M1 of the power switch circuit 302 comprises thep-type diffusion nanowire 702 and the conductive layers 804_1-804_a. ThenFET M2 of the power switch circuit 302 comprises the n-type diffusionnanowire 810_2 and the conductive layers 806_2-806_(b−1). As the nFET M2is formed on the existing area or dummy area under the pFET M1, the nFETM2 does not occupy extra area of the layout 800. Therefore, theperformance the power switch circuit 302 may be improved by using theCFET structure without extra area penalty. More specifically, in anexisting power switch circuit, the nFET M2 may be configured to be adummy FET, which occupies area but does not improve the performance ofthe existing power switch circuit. On the contrary, in the presentembodiments, the area of the dummy FET is reconfigured to be an FET(e.g. M2) that may boost the performance of the power switch circuitwithout extra area penalty.

FIG. 9A is a diagram illustrating an IC structure 900A of a power switchcircuit in accordance with some embodiments. The IC structure 900A maybe a portion of a CFET IC structure in which the p-type diffusionnanowire is vertically stacked on the n-type diffusion nanowire. Thepower switch circuit may be the above-mentioned power switch circuits302, 502, or 602. In this embodiment, the power switch circuit isconfigured to be a header switch of an IC module. The IC structure 900Acomprises a p-type diffusion nanowire 902, an n-type diffusion nanowire904, a plurality of first conductive layers (e.g. 906 and 908), and aplurality of second conductive layers (e.g. 910 and 912). The p-typediffusion nanowire 902 and the n-type diffusion nanowire 904 arearranged to stack along the z-axis, and the p-type diffusion nanowire902 is vertically stacked on the n-type diffusion nanowire 904. Theconductive layers 906 and 908 are formed on the same level with thep-type diffusion nanowire 902 along y-axis. The conductive layers 910and 912 are formed on the same level with the p-type diffusion nanowire902 along y-axis. The conductive layers 906 and 908 are arranged to gatethe p-type diffusion nanowire 902. The conductive layers 910 and 912 arearranged to gate the n-type diffusion nanowire 904.

According to some embodiments, the conductive layer 906 is aligned withthe conductive layer 910 along the z-axis, and the conductive layer 908is aligned with the conductive layer 912 along the z-axis. Moreover, theconductive layer 906 is physically separated from the conductive layer910, and the conductive layer 908 is physically separated from theconductive layer 912.

According to some embodiments, the p-type diffusion nanowire 902 and theconductive layers 906 and 908 are arranged to form a gate-all-aroundPFET (e.g. M1). Therefore, the conductive layers 906 and 908 areelectrically connected to an enable signal (e.g. Se) of the power switchcircuit. The nanowire portions 9022 and 9024 are electrically connectedto a core supply voltage (e.g. VDD) and the nanowire portion 9026 isarranged to provide an intermediate supply voltage (e.g. VDD_in) to theIC module.

In addition, the n-type diffusion nanowire 904 and the conductive layers910 and 910 are arranged to form a gate-all-around NFET (e.g. M2).Therefore, the conductive layers 910 and 912 are electrically connectedto an inverting signal of the enable signal (e.g. the inverted voltagelevel of the enable signal Se) of the power switch circuit. In addition,the nanowire portions 9042 and 9044 are electrically connected to a coresupply voltage (e.g. VDD) and the nanowire portion 9046 is arranged toprovide an intermediate supply voltage (e.g. VDD_in) to the IC module.

The gate-all-around (GAA) transistor structures may be patterned by anysuitable method. For example, the structures may be patterned using oneor more photolithography processes, including double-patterning ormulti-patterning processes. Generally, double-patterning ormulti-patterning processes combine photolithography and self-alignedprocesses, allowing patterns to be created that have, for example,pitches smaller than what is otherwise obtainable using a single, directphotolithography process. For example, in one embodiment, a sacrificiallayer is formed over a substrate and patterned using a photolithographyprocess. Spacers are formed alongside the patterned sacrificial layerusing a self-aligned process. The sacrificial layer is then removed, andthe remaining spacers may then be used to pattern the GAA structure.

FIG. 9B is a diagram illustrating an IC structure 900B of a power switchcircuit in accordance with some embodiments. The IC structure 900B maybe a portion of a CFET IC structure in which the n-type diffusionnanowire is vertically stacked on the p-type diffusion nanowire. Thepower switch circuit may be the above-mentioned power switch circuits302, 502, or 602. In this embodiment, the power switch circuit isconfigured to be a header switch of an IC module. The IC structure 900Bcomprises an n-type diffusion nanowire 914, a p-type diffusion nanowire916, a plurality of first conductive layers (e.g. 918 and 920), and aplurality of second conductive layers (e.g. 922 and 924). In comparisonto the IC structure 900A, the n-type diffusion nanowire 914 of the ICstructure 900B is vertically stacked on the p-type diffusion nanowire916 of the IC structure 900B. In other words, the positions of the PFET,which comprises the p-type diffusion nanowire 916 and the conductivelayers 922 and 924, and the NFET, which comprises the n-type diffusionnanowire 914 and the conductive layers 918 and 920, of the IC structure900B are different from the positions of the PFET and the NFET of the ICstructure 900A.

According to some embodiments, the conductive layers 918 and 920 areelectrically connected to an enable signal (e.g. Se) of the power switchcircuit. The nanowire portions 9142 and 9144 are electrically connectedto a core supply voltage (e.g. VDD) and the nanowire portion 9146 isarranged to provide an intermediate supply voltage (e.g. VDD_in) to theIC module. In addition, the conductive layers 922 and 924 areelectrically connected to an inverting signal of the enable signal (e.g.the inverted voltage level of the enable signal Se) of the power switchcircuit. In addition, the nanowire portions 9162 and 9164 areelectrically connected to a core supply voltage (e.g. VDD) and thenanowire portion 9166 is arranged to provide an intermediate supplyvoltage (e.g. VDD_in) to the IC module.

FIG. 10A is a diagram illustrating an IC structure 1000A of a powerswitch circuit in accordance with some embodiments. The IC structure1000A may be a portion of a CFET IC structure in which the p-typediffusion nanowire is vertically stacked on the n-type diffusionnanowire. In comparison to the power switch circuit of FIG. 9A, thepower switch circuit of FIG. 10A is configured to be a footer switch ofan IC module. Except for the connecting signals, the IC structure 1000Ais similar to the IC structure 900A. Therefore, the detailed descriptionof the IC structure 1000A is omitted here for brevity.

According to some embodiments, the p-type diffusion nanowire 1002 andthe conductive layers 1006 and 1008 are configured to be a PFET. Then-type diffusion nanowire 1004 and the conductive layers 1010 and 1012are configured to be an NFET. The conductive layers 1006 and 1008 areelectrically connected to an enable signal (e.g. Se) of the power switchcircuit. The nanowire portions 10022 and 10024 are electricallyconnected to a core ground voltage (e.g. VGND) and the nanowire portion10026 is arranged to provide an intermediate ground voltage (e.g.VGND_in) to the IC module. In addition, the conductive layers 1010 and1012 are electrically connected to an inverting signal of the enablesignal (e.g. the inverted voltage level of the enable signal Se) of thepower switch circuit. In addition, the nanowire portions 10042 and 10044are electrically connected to a core ground voltage (e.g. VGND) and thenanowire portion 10046 is arranged to provide an intermediate groundvoltage (e.g. VGND_in) to the IC module.

FIG. 10B is a diagram illustrating an IC structure 1000B of a powerswitch circuit in accordance with some embodiments. The IC structure1000B may be a portion of a CFET IC structure in which the n-typediffusion nanowire is vertically stacked on the p-type diffusionnanowire. In comparison to the power switch circuit of FIG. 9B, thepower switch circuit of FIG. 10B is configured to be a footer switch ofan IC module. Except for the connecting signals, the IC structure 1000Bis similar to the IC structure 900B. Therefore, the detailed descriptionof the IC structure 1000B is omitted here for brevity.

According to some embodiments, the n-type diffusion nanowire 1014 andthe conductive layers 1018 and 1020 are configured to be an NFET. Thep-type diffusion nanowire 1016 and the conductive layers 1022 and 1024are configured to be a PFET. The conductive layers 1018 and 1010 areelectrically connected to an enable signal (e.g. Se) of the power switchcircuit. The nanowire portions 10142 and 10144 are electricallyconnected to a core ground voltage (e.g. VGND) and the nanowire portion10146 is arranged to provide an intermediate ground voltage (e.g.VGND_in) to the IC module. In addition, the conductive layers 1022 and1024 are electrically connected to an inverting signal of the enablesignal (e.g. the inverted voltage level of the enable signal Se) of thepower switch circuit. In addition, the nanowire portions 10162 and 10164are electrically connected to a core ground voltage (e.g. VGND) and thenanowire portion 10166 is arranged to provide an intermediate groundvoltage (e.g. VGND_in) to the IC module.

The IC structure 900A comprises a p-type diffusion nanowire 902, ann-type diffusion nanowire 904, a plurality of first conductive layers(e.g. 906 and 908), and a plurality of second conductive layers (e.g.910 and 912). The p-type diffusion nanowire 902 and the n-type diffusionnanowire 904 are arranged to stack along the z-axis, and the p-typediffusion nanowire 902 is vertically stacked on the n-type diffusionnanowire 904. The conductive layers 906 and 908 are formed on the samelevel with the p-type diffusion nanowire 902 along y-axis. Theconductive layers 910 and 912 are formed on the same level with thep-type diffusion nanowire 902 along y-axis. The conductive layers 906and 908 are arranged to gate the p-type diffusion nanowire 902. Theconductive layers 910 and 912 are arranged to gate the n-type diffusionnanowire 904.

FIG. 11A is a diagram illustrating an IC structure 1100A of a powerswitch circuit in accordance with some embodiments. The IC structure1100A may be a portion of a CFET IC structure in which the p-typediffusion nanowire is vertically stacked on the n-type diffusionnanowire. In comparison to the power switch circuit of FIG. 9A, thepower switch circuit of FIG. 11A is configured to be a header switch anda footer switch of an IC module. Except for the connecting signals, theIC structure 1100A is similar to the IC structure 900A. Therefore, thedetailed description of the IC structure 1100A is omitted here forbrevity.

According to some embodiments, the p-type diffusion nanowire 1102 andthe conductive layers 1106 and 1108 are configured to be a PFET of theheader switch of the IC module. The n-type diffusion nanowire 1104 andthe conductive layers 1110 and 1112 are configured to be an NFET of thefooter switch of the IC module. The conductive layers 1106 and 1108 areelectrically connected to an enable signal (e.g. Se) of the power switchcircuit. The nanowire portions 11022 and 11024 are electricallyconnected to a core supply voltage (e.g. VDD) and the nanowire portion11026 is arranged to provide an intermediate supply voltage (e.g.VDD_in) to the IC module. In addition, the conductive layers 1110 and1112 are electrically connected to an inverting signal of the enablesignal (e.g. the inverted voltage level of the enable signal Se) of thepower switch circuit. In addition, the nanowire portions 11042 and 11044are electrically connected to a core ground voltage (e.g. VGND) and thenanowire portion 11046 is arranged to provide an intermediate groundvoltage (e.g. VGND_in) to the IC module.

FIG. 11B is a diagram illustrating an IC structure 1100B of a powerswitch circuit in accordance with some embodiments. The IC structure1100B may be a portion of a CFET IC structure in which the n-typediffusion nanowire is vertically stacked on the p-type diffusionnanowire. In comparison to the power switch circuit of FIG. 9B, thepower switch circuit of FIG. 11B is configured to be a footer switch anda header switch of an IC module. Except for the connecting signals, theIC structure 1100B is similar to the IC structure 900B. Therefore, thedetailed description of the IC structure 1100B is omitted here forbrevity.

According to some embodiments, the n-type diffusion nanowire 1114 andthe conductive layers 1118 and 1120 are configured to be an NFET of thefooter switch of the IC module. The p-type diffusion nanowire 1116 andthe conductive layers 1122 and 1124 are configured to be a PFET of theheader switch of the IC module. The conductive layers 1118 and 1110 areelectrically connected to an enable signal (e.g. Se) of the power switchcircuit. The nanowire portions 11142 and 11144 are electricallyconnected to a core ground voltage (e.g. VGND) and the nanowire portion11146 is arranged to provide an intermediate ground voltage (e.g.VGND_in) to the IC module. In addition, the conductive layers 1122 and1124 are electrically connected to an inverting signal of the enablesignal (e.g. the inverted voltage level of the enable signal Se) of thepower switch circuit. In addition, the nanowire portions 11162 and 11164are electrically connected to a core supply voltage (e.g. VDD) and thenanowire portion 11166 is arranged to provide an intermediate supplyvoltage (e.g. VDD_in) to the IC module.

According to some embodiments, the p-type diffusion nanowire 1102 andthe n-type diffusion nanowire 1104 (as well as the n-type diffusionnanowire 1114 and the p-type diffusion nanowire 1116) are twoconsecutive gate-all-around nanowires disposed on the z-axis, in whichthe p-type diffusion nanowire 1102 is configured to be the header switchof the IC mode and the n-type diffusion nanowire 1104 is configured tobe the footer switch of the IC mode. As shown in FIG. 7 and FIG. 8, thep-type diffusion nanowire 1102 may be the p-type diffusion nanowire 702,and the n-type diffusion nanowire 1104 may be the n-type diffusionnanowire 704. Therefore, the present power switch circuit may beimplemented by the CFET structure without extra area penalty.

FIG. 12A is a diagram illustrating an IC structure 1200A of a powerswitch circuit in accordance with some embodiments. The IC structure1200A may be a portion of a CFET IC structure in which the p-typediffusion nanowire is vertically stacked on the n-type diffusionnanowire. In comparison to the power switch circuit of FIG. 9A, theconductive layers 906 and 910 are configured to be a single conductivelayer 1206, the conductive layers 908 and 912 are configured to be asingle conductive layer 1208, and the power switch circuit of FIG. 12Ais configured to be a header switch and a footer switch of an IC module.The detailed description of the IC structure 1200A is omitted here forbrevity.

According to some embodiments, the p-type diffusion nanowire 1202 andthe conductive layers 1206 and 1208 are configured to be a PFET of theheader switch of the IC module. The n-type diffusion nanowire 1204 andthe conductive layers 1206 and 1208 are configured to be an NFET of thefooter switch of the IC module. The conductive layers 1206 and 1208 areelectrically connected to an enable signal (e.g. Se) of the power switchcircuit. The p-type diffusion nanowire 1202 and the n-type diffusionnanowire 1204 are gated by the upper portions of the conductive layers1206 and 1208 and the upper portions of the conductive layers 1206 and1208 respectively. Accordingly, in this embodiment, the PFET of theheader switch and the NFET of the footer switch are controlled by thesame enable signal.

The nanowire portions 12022 and 12024 are electrically connected to acore supply voltage (e.g. VDD) and the nanowire portion 12026 isarranged to provide an intermediate supply voltage (e.g. VDD_in) to theIC module. The nanowire portions 12042 and 12044 are electricallyconnected to a core ground voltage (e.g. VGND) and the nanowire portion12046 is arranged to provide an intermediate ground voltage (e.g.VGND_in) to the IC module.

FIG. 12B is a diagram illustrating an IC structure 1200B of a powerswitch circuit in accordance with some embodiments. The IC structure1200B may be a portion of a CFET IC structure in which the n-typediffusion nanowire is vertically stacked on the p-type diffusionnanowire. In comparison to the power switch circuit of FIG. 9B, theconductive layers 918 and 922 are configured to be a single conductivelayer 1218, the conductive layers 920 and 924 are configured to be asingle conductive layer 1220, and the power switch circuit of FIG. 12Bis configured to be a footer switch and a header switch of an IC module.The detailed description of the IC structure 1200B is omitted here forbrevity.

According to some embodiments, the n-type diffusion nanowire 1214 andthe conductive layers 1218 and 1220 are configured to be a NFET of thefooter switch of the IC module. The p-type diffusion nanowire 1216 andthe conductive layers 1218 and 1220 are configured to be a PFET of theheader switch of the IC module. The conductive layers 1218 and 1220 areelectrically connected to an enable signal (e.g. Se) of the power switchcircuit. The n-type diffusion nanowire 1214 and the p-type diffusionnanowire 1216 are gated by the upper portions of the conductive layers1218 and 1220 and the lower portions of the conductive layers 1218 and1220 respectively. Accordingly, in this embodiment, the NFET of thefooter switch and the PFET of the header switch are controlled by thesame enable signal.

The nanowire portions 12142 and 12144 are electrically connected to acore ground voltage (e.g. VGND) and the nanowire portion 12146 isarranged to provide an intermediate ground voltage (e.g. VGND_in) to theIC module. The nanowire portions 12162 and 12164 are electricallyconnected to a core supply voltage (e.g. VDD) and the nanowire portion12166 is arranged to provide an intermediate supply voltage (e.g.VDD_in) to the IC module.

In addition, the number of the conductive layers (i.e. the two nets 1206and 1208) of the power switch circuit in FIG. 12A and the number of theconductive layers (i.e. the two nets 1218 and 1220) of the power switchcircuit in FIG. 12B are merely used for the descriptive purposes. Thenumber of the conductive layers of the power switch circuit in FIG. 12Aand the number of the conductive layers of the power switch circuit inFIG. 12B are not limited by 2. According to some embodiments, the numberof the conductive layers of the power switch circuit in FIG. 12A and thenumber of the conductive layers of the power switch circuit in FIG. 12Bare greater than 10 nets. When the number of the conductive layers ofthe power switch circuit in FIG. 12A and the number of the conductivelayers of the power switch circuit in FIG. 12B are greater than 10 nets,the power switch circuit in FIG. 12A and the conductive layers of thepower switch circuit in FIG. 12B may have relatively wide conductivepaths to conduct the supply currents to the IC modules respectively.

According to some embodiments, the p-type diffusion nanowire 1202 andthe n-type diffusion nanowire 1204 (as well as the n-type diffusionnanowire 1214 and the p-type diffusion nanowire 1216) are twoconsecutive gate-all-around nanowires disposed on the z-axis, in whichthe p-type diffusion nanowire 1202 is configured to be the header switchof the IC mode and the n-type diffusion nanowire 1204 is configured tobe the footer switch of the IC mode. As shown in FIG. 7 and FIG. 8, thep-type diffusion nanowire 1202 may be the p-type diffusion nanowire 702,and the n-type diffusion nanowire 1204 may be the n-type diffusionnanowire 704. Therefore, the present power switch circuit may beimplemented by the CFET structure without extra area penalty.

FIG. 13A is a diagram illustrating an IC structure 1300A of a powerswitch circuit in accordance with some embodiments. The IC structure1300A may be a portion of a CFET IC structure in which a p-typediffusion nanowire is vertically stacked on another p-type diffusionnanowire. In comparison to the power switch circuit of FIG. 12A, thep-type diffusion nanowire 1302 and the p-type diffusion nanowire 1304 ofFIG. 13A are two consecutive nanowires along the z-axis, and the powerswitch circuit of FIG. 13A is configured to be a header switch of an ICmodule. The detailed description of the IC structure 1300A is omittedhere for brevity.

According to some embodiments, the p-type diffusion nanowires 1302 and1304 and the conductive layers 1306 and 1308 are configured to be twoPFETs of the header switch of the IC module. The conductive layers 1306and 1308 are electrically connected to an enable signal (e.g. Se) of thepower switch circuit. The p-type diffusion nanowires 1302 and 1304 aregated by the conductive layers 1306 and 1308. Accordingly, in thisembodiment, the PFETs of the header switch are controlled by the sameenable signal.

The nanowire portions 13022, 13024, 13042, and 13044 are electricallyconnected to a core supply voltage (e.g. VDD) and the nanowire portions13026 and 13046 are arranged to provide an intermediate supply voltage(e.g. VDD_in) to the IC module.

FIG. 13B is a diagram illustrating an IC structure 1300B of a powerswitch circuit in accordance with some embodiments. The IC structure1300B may be a portion of a CFET IC structure in which an n-typediffusion nanowire is vertically stacked on another n-type diffusionnanowire. In comparison to the power switch circuit of FIG. 12B, then-type diffusion nanowire 1314 and the n-type diffusion nanowire 1316 ofFIG. 13A are two consecutive nanowires along the z-axis, and the powerswitch circuit of FIG. 13B is configured to be a footer switch of an ICmodule. The detailed description of the IC structure 1300B is omittedhere for brevity.

According to some embodiments, the n-type diffusion nanowires 1314 and1316 and the conductive layers 1318 and 1320 are configured to be twoNFETs of the footer switch of the IC module. The conductive layers 1318and 1320 are electrically connected to an enable signal (e.g. Se or theinverted Se) of the power switch circuit. The n-type diffusion nanowires1314 and 1316 are gated by the conductive layers 1318 and 1320.Accordingly, in this embodiment, the NFETs of the footer switch arecontrolled by the same enable signal.

The nanowire portions 13142, 13144, 13162, and 13164 are electricallyconnected to a core ground voltage (e.g. VGND) and the nanowire portions13146 and 13166 are arranged to provide an intermediate ground voltage(e.g. VGND_in) to the IC module.

According to some embodiments, the p-type diffusion nanowires 1302 and1304 and the n-type diffusion nanowires 1314 and 1316 may be fourconsecutive nanowires along the z-axis, in which the p-type diffusionnanowires 1302 and 1304 are configured to be the header switch of the ICmode and the n-type diffusion nanowires 1314 and 1316 are configured tobe the footer switch of the IC mode. Therefore, the present power switchcircuit may be implemented by the CFET structure without extra areapenalty.

According to some embodiments, the number of the conductive layers ofthe power switch circuits in FIG. 9A, FIG. 10A, FIG. 11A, and FIG. 13A,and the number of the conductive layers of the power switch circuits inFIG. 9B, FIG. 10B, FIG. 11B, and FIG. 13B are merely used for thedescriptive purposes. To have relatively wide conductive paths toconduct the supply currents to the IC modules respectively, the numberof the conductive layers of the power switch circuits in FIG. 9A, FIG.10A, FIG. 11A, and FIG. 13A, and the number of the conductive layers ofthe power switch circuits in FIG. 9B, FIG. 10B, FIG. 11B, and FIG. 13Bmay be greater than 10 nets.

FIG. 14 is a flowchart illustrating a method 1400 of forming an ICstructure in accordance with some embodiments. The method 1400 may beperformed in the operation 216 of FIG. 2. The method 1400 is executableby a semiconductor fabricator. Some of the operations in the method 1400may by manually executed. According to some embodiments, the method 1400may be arranged to form or fabricate the above mentioned IC structure900A, 900B, 1000A, 1000B, 1100A, 1100B, 1200A, 1200B, 1300A, and 1300B.For the purpose of description, the method 1400 is described by usingthe example of IC structure 900A.

According to some embodiments, the method 1400 comprises operations1402˜1412. In operation 1402, the n-type diffusion nanowire 904 isdisposed on a semiconductor substrate. In operation 1404, the p-typediffusion nanowire 902 is disposed over the n-type diffusion nanowire904 along the z-axis.

In operation 1406, the plurality of conductive layers 910 and 912 areformed to surround the n-type diffusion nanowire 904 to form a gateelectrode of an nFET. According to some embodiments, the plurality ofconductive layers 910 and 912 are arranged to extend along the y-axis.

In operation 1408, the plurality of conductive layers 906 and 908 areformed to surround the p-type diffusion nanowire 902 to form a gateelectrode of a pFET. According to some embodiments, the plurality ofconductive layers 906 and 908 are arranged to extend along the y-axis.

It is noted that plurality of conductive layers 906, 908, 910, and 912are not directly contacted with the p-type diffusion nanowire 902 andthe n-type diffusion nanowire 904. For each conductive layer, at least agate dielectric or a dielectric layer (not shown) is disposed betweenthe conductive layer (e.g. 910) and the diffusion nanowire (e.g. 904).

In operation 1410, the nanowire portions 9042 and 9044 are electricallyconnected to a core supply voltage (e.g. VDD or VGND) and the nanowireportion 9046 is arranged to provide an intermediate supply voltage (e.g.VDD_in) to the IC module.

In operation 1412, the nanowire portions 9022 and 9024 are electricallyconnected to the core supply voltage (e.g. VDD or VGND) and the nanowireportion 9026 is arranged to provide the intermediate supply voltage(e.g. VDD_in) to the IC module.

According to some embodiments, for the IC structure 900A (as well as900B, 1000A, 1000B, 1300A, and 1300B), the nanowire portions 9042 and9044 are electrically connected to the nanowire portions 9022 and 9024respectively. For the IC structure 1100A (as well as 1100B, 1200A, and1200B), the nanowire portions 11042 and 11044 are physically separatedfrom the nanowire portions 11022 and 11024 respectively.

According to some embodiments, the nanowire portions 9042, 9044, and9046 are aligned with the nanowire portions 9022, 9024, and 9026 alongthe z-axis respectively. The conductive layers 906 and 908 are alignedwith the conductive layers 910 and 912 along the z-axis respectively.

According to some embodiments, for the IC structure 900A (as well as900B, 1000A, 1000B, 1100A, and 1100B), the method 1400 further comprisesan operation to physically separate the conductive layers 906 and 908from the conductive layers 910 and 912 respectively. On the other hand,for the IC structure 1200A (as well as 1200B, 1300A, and 1300B), themethod 1400 further comprises an operation to electrically couple theupper portions of the conductive layers 1206 and 1208 to the lowerportions of the conductive layers 1206 and 1208 respectively.

Briefly, the proposed embodiment provides a power switch circuitimplemented by CFET structure. The power switch circuit may mitigate thedifferent wake up times of the power switch circuit caused by theprocess variation. Moreover, the power switch circuit is arranged toreuse the dummy area in the CFET structure. Therefore, the performancethe power switch circuit may be improved without the extra area penalty.

In some embodiments, the present disclosure provides an integratedcircuit device. The integrated circuit device comprises an integratedcircuit module, a first field-effect transistor, and a secondfield-effect transistor. The first field-effect transistor is coupledbetween the integrated circuit module and a first reference voltage, andcontrolled by a first controlled signal. The second field-effecttransistor is coupled between the integrated circuit module and thefirst reference voltage. The second field-effect transistor is acomplementary field-effect transistor of the first field-effecttransistor, and the first field-effect transistor and the secondfield-effect transistor are configured to generate a second referencevoltage for the integrated circuit module according to the first controlsignal.

In some embodiments, the present disclosure provides an IC structure.The IC structure comprises a first diffusion nanowire, a seconddiffusion nanowire, a plurality of first conductive layers, and aplurality of second conductive layers. The first diffusion nanowire isdisposed on a substrate. The second diffusion nanowire is stacked overthe first diffusion nanowire along a first direction. The plurality offirst conductive layers is arranged to surround the first diffusionnanowire to form a first gate electrode, wherein the plurality of firstconductive layers are arranged to extend along a second direction. Theplurality of second conductive layers is arranged to surround the seconddiffusion nanowire to form a second gate electrode, wherein theplurality of second conductive layers are arranged to extend along thesecond direction. A first portion of the first diffusion nanowire iselectrically coupled to a first reference voltage, a second portion ofthe second diffusion nanowire is electrically coupled to a secondreference voltage, and a third portion of the first diffusion nanowireis electrically coupled to a fourth portion of the second diffusionnanowire, the first portion of the first diffusion nanowire is alignedwith the second portion of the second diffusion nanowire along the firstdirection, and the third portion of the first diffusion nanowire isaligned with the fourth portion of the second diffusion nanowire alongthe first direction.

In some embodiments, the present disclosure provides a method of formingan IC structure. The method comprises: disposing a first diffusionnanowire on a substrate; disposing a second diffusion nanowire over thefirst diffusion nanowire along a first direction; forming a plurality offirst conductive layers to surround the first diffusion nanowire to forma first gate electrode, wherein the plurality of first conductive layersare arranged to extend along a second direction; forming a plurality ofsecond conductive layers to surround the second diffusion nanowire toform a second gate electrode, wherein the plurality of second conductivelayers are arranged to extend along the second direction; wherein afirst portion of the first diffusion nanowire is configured to beelectrically coupled to a first reference voltage and a second portionof the second diffusion nanowire is configured to be electricallycoupled to a second reference voltage; a third portion of the firstdiffusion nanowire is configured to be electrically coupled to a fourthportion of the second diffusion nanowire; wherein the first portion ofthe first diffusion nanowire is aligned with the second portion of thesecond diffusion nanowire along the first direction, and the thirdportion of the first diffusion nanowire is aligned with the fourthportion of the second diffusion nanowire along the first direction.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. An integrated circuit device, comprising: anintegrated circuit module; a first field-effect transistor, coupledbetween the integrated circuit module and a first reference voltage, andcontrolled by a first controlled signal; and a second field-effecttransistor, coupled between the integrated circuit module and the firstreference voltage; wherein the second field-effect transistor is acomplementary field-effect transistor of the first field-effecttransistor, and the first field-effect transistor and the secondfield-effect transistor are configured to generate a second referencevoltage for the integrated circuit module according to the first controlsignal.
 2. The integrated circuit device of claim 1, wherein the firstfield-effect transistor comprises a first connecting terminal coupled tothe first reference voltage, a second connecting terminal coupled to theintegrated circuit module for outputting the second reference voltage,and a control terminal coupled to the first control signal; and thesecond field-effect transistor comprises a first connecting terminalcoupled to the first reference voltage, a second connecting terminalcoupled to the integrated circuit module for outputting the secondreference voltage, and a control terminal coupled to a second controlsignal different from the first control signal.
 3. The integratedcircuit device of claim 2, further comprising: an inverter, having aninput terminal coupled to the control terminal of the first field-effecttransistor, and an output terminal coupled to the control terminal ofthe second field-effect transistor; wherein the second connectingterminal of the first field-effect transistor and the second connectingterminal of the second field-effect transistor are arranged to provide asecond reference voltage for the integrated circuit module.
 4. Theintegrated circuit device of claim 1, wherein the first field-effecttransistor comprises a first connecting terminal coupled to the firstreference voltage, a second connecting terminal coupled to theintegrated circuit module for outputting the second reference voltage,and a control terminal coupled to the first control signal; and thesecond field-effect transistor comprises a first connecting terminalcoupled to the first reference voltage, a second connecting terminalcoupled to the integrated circuit module for outputting the secondreference voltage, and a control terminal coupled to the first referencevoltage.
 5. The integrated circuit device of claim 1, wherein the firstfield-effect transistor comprises a first connecting terminal coupled tothe first reference voltage, a control terminal coupled to the firstcontrol signal; and the second field-effect transistor comprises a firstconnecting terminal coupled to a second connecting terminal of the firstfield-effect transistor, a second connecting terminal coupled to theintegrated circuit module for outputting the second reference voltage,and a control terminal coupled to the first connecting terminal of thesecond field-effect transistor.
 6. An integrated circuit (IC) structure,comprising: a first diffusion nanowire, disposed on a substrate; asecond diffusion nanowire, stacked over the first diffusion nanowirealong a first direction; a plurality of first conductive layers,arranged to surround the first diffusion nanowire to form a first gateelectrode, wherein the plurality of first conductive layers are arrangedto extend along a second direction; and a plurality of second conductivelayers, arranged to surround the second diffusion nanowire to form asecond gate electrode, wherein the plurality of second conductive layersare arranged to extend along the second direction; wherein a firstportion of the first diffusion nanowire is configured to be electricallycoupled to a first reference voltage, a second portion of the seconddiffusion nanowire is configured to be electrically coupled to a secondreference voltage, and a third portion of the first diffusion nanowireis configured to be electrically coupled to a fourth portion of thesecond diffusion nanowire, the first portion of the first diffusionnanowire is aligned with the second portion of the second diffusionnanowire along the first direction, and the third portion of the firstdiffusion nanowire is aligned with the fourth portion of the seconddiffusion nanowire along the first direction.
 7. The IC structure ofclaim 6, wherein the plurality of first conductive layers are alignedwith the plurality of second conductive layers along the first directionrespectively, and the plurality of first conductive layers arephysically separated from the plurality of second conductive layers. 8.The IC structure of claim 7, wherein the first diffusion nanowire is ann-type diffusion nanowire, and the second diffusion nanowire is a p-typediffusion nanowire.
 9. The IC structure of claim 7, wherein the firstdiffusion nanowire is a p-type diffusion nanowire, and the seconddiffusion nanowire is an n-type diffusion nanowire.
 10. The IC structureof claim 6, wherein the plurality of first conductive layers are alignedwith the plurality of second conductive layers along the first directionrespectively, and the plurality of first conductive layers areelectrically coupled to the plurality of second conductive layersrespectively.
 11. The IC structure of claim 10, wherein the firstdiffusion nanowire and the second diffusion nanowire are p-typediffusion nanowire.
 12. The IC structure of claim 10, wherein the firstdiffusion nanowire and the second diffusion nanowire are n-typediffusion nanowire.
 13. The IC structure of claim 6, wherein the firstreference voltage and the second reference voltage are the samereference voltage.
 14. The IC structure of claim 6, wherein the firstreference voltage and the second reference voltage are differentreference voltages.
 15. A method of forming an integrated circuit (IC)structure, comprising: disposing a first diffusion nanowire on asubstrate; disposing a second diffusion nanowire over the firstdiffusion nanowire along a first direction; forming a plurality of firstconductive layers to surround the first diffusion nanowire to form afirst gate electrode, wherein the plurality of first conductive layersare arranged to extend along a second direction; and forming a pluralityof second conductive layers to surround the second diffusion nanowire toform a second gate electrode, wherein the plurality of second conductivelayers are arranged to extend along the second direction; wherein afirst portion of the first diffusion nanowire is configured to beelectrically coupled to a first reference voltage and a second portionof the second diffusion nanowire is configured to be electricallycoupled to a second reference voltage; a third portion of the firstdiffusion nanowire is configured to be electrically coupled to a fourthportion of the second diffusion nanowire; and the first portion of thefirst diffusion nanowire is aligned with the second portion of thesecond diffusion nanowire along the first direction, and the thirdportion of the first diffusion nanowire is aligned with the fourthportion of the second diffusion nanowire along the first direction. 16.The method of claim 15, further comprising: physically separating theplurality of first conductive layers from the plurality of secondconductive layers.
 17. The method of claim 15, further comprising:electrically coupling the plurality of first conductive layers to theplurality of second conductive layers respectively.
 18. The method ofclaim 15, wherein the plurality of first conductive layers are alignedwith the plurality of second conductive layers along the first directionrespectively,
 19. The method of claim 15, wherein the first referencevoltage and the second reference voltage are the same reference voltage.20. The method of claim 15, wherein the first reference voltage and thesecond reference voltage are different reference voltages.